With the growing number of process challenges that engineers face in high volume manufacturing, the ability to quickly analyze relevant data from multiple chambers is vital for effective troubleshooting. Particularly for plasma etch and deposition processes, understanding the complete characteristics of the plasma (e.g., RF, plasma composition) in the context of appropriate tool trace data is critically important for identifying sources of variation and controlling the process outcome.

Pivotal's ToolTrace™ solution gives process and equipment engineers added insight and visibility into their key plasma etch and deposition processes, allowing them to effectively troubleshoot outlier performance, reduce overall process window variations, and match performance chamber to chamber. ToolTrace™ combines non-intrusive in situ sensors (e.g., RF, plasma composition, OES) with a mature industrial data collection and visualization platform designed specifically for high volume fab environments. This platform, which is Linux based and easily adapted to any fab standard or protocol, is production-proven with over six years of continuous improvement.

With installations at leading high-volume fabs around the world, ToolTrace™ has proven itself to be a versatile and important tool, with benefits ranging from simple chamber monitoring to better understanding of complex chamber matching and tool-related yield issues.

ToolTrace™ Benefits

Tool monitoring and fault detection

Continuously monitor all key tool parameters Drill down through all tool parameters for extremely fast resolution Analyze longer-term tool trends (e.g. over several wet cleans)

Chamber matching

Match tool performance at a more granular level by ensuring real-time RF and tool-level trace data values are consistent (e.g. power delivered, pressure, temperature) Qualify new tools more effectively

Yield improvement

Improve yield by ensuring key tool process parameters are in spec and highly centered