In high volume manufacturing, consistently and reliably calling end point on dielectric plasma etch processes where the exposed area is less than 1% has been an elusive goal, with most fabs running inefficient and often costly fixed time approaches. Omega3.0™ is a revolutionary plasma etch end point system designed specifically to provide one end point solution that works across a myriad of dielectric etch processes (via, contact, trench) where the exposed areas range from less than 1% to full coverage.

Omega3.0™ combines non-intrusive in situ (e.g., RF, plasma composition) sensors with Pivotal's proprietary PlasmaMODEL™ software to achieve a real-time highly accurate characterization of the wafer surface during processing, something largely immeasurable with other approaches. Through this real-time capability, the Omega3.0™ system can readily determine the time at which complete clearing of distinct film layers occurs and immediately call the end point. For any particular chamber type, the system seamlessly works across a number of dielectric etch mask levels, technology nodes, processes and film types.

The production result is a highly centered, repeatable, and reliable dielectric etch process that improves device yield / bin sort characteristics, accommodates incoming film thickness variations, improves tool throughput, and serves as an effective tool for real-time outlier identification and diagnosis.

The Omega3.0™ system can also be used as a real-time fault detection system to catch key wafer mis-processing events such as etch stop, double etching of wafers or etching of double deposited wafers.

Omega3.0™ Benefits

• Improved parametrics / yield through optimal via / contact CD and profile
• Increased tool throughput
• End point process window centering
• Fault detection, diagnostics, and chamber matching
• Compensates for incoming CVD and photo variations

View our joint Qimonda presentation: "A new method for very low open area endpoint detection" - AEC/APC Conference April 18th, 2007. (PDF 2Mb)