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Products and Applications CleanEP™ Detecting and controlling the end point of CVD or Etch dry clean processes is a key enabler to increase wafer throughput and reduce overall tool cost of ownership. CleanEP™ is a robust, cost-effective end point system for in situ control of CVD dry clean processes. CleanEP™ combines non-intrusive in situ RF sensors with Pivotal's proprietary PlasmaMODEL™ software to achieve a real-time characterization of the entire chamber environment during the dry clean process. Through this real-time capability, the CleanEP™ solution can readily detect the time at which all dielectric material has been removed from the chamber and call end point, thereby avoiding significant over-cleaning. This precise, active control delivers a consistent chamber environment after each and every dry clean. CleanEP™ works seamlessly across myriad different dielectric film processes (e.g. FSG, OSG, USG) and fluorine based clean chemistries. Furthermore, because the RF sensor technology provides a characterization of the entire chamber during the clean cycle, CleanEP™ is a superior alternative to OES (optical emission spectroscopy) systems which often suffer from line of sight issues and cloudy window effects. The production result is a consistent and repeatable clean process that ensures just the right amount of cleaning - time after time. Costly over-cleaning margins are removed for increased tool throughput, reduction of gas consumables, and extension of chamber parts. A significant additional benefit is that any particle issues related to over or under cleaning (as a result of inherently imprecise timed cleans) are eliminated.
![]() Benefits for etch chamber cleans:
CVD Short Dry Clean Cycle Example:
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![]() CleanEP™ Benefits
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